真空触头材料显微组织对饱和蒸气压及截流值的影响  

Influence of Microstructure in Vacuum Contact Materials on Saturated Vapor Pressure and Chopping Current

作　　者：严群[1] 杨志懋[2] 丁秉钧[2] 王笑天[2] 

机构地区：[1]四川联合大学,成都610065 [2]西安交通大学,710049

出　　处：《高压电器》1995年第6期28-31,共4页High Voltage Apparatus

基　　金：国家自然科学基金资助项目

摘　　要：通过建立CuCr合金中晶粒尺寸影响饱和蒸气压进而影响截流值的热力学模型,从理论上初步探讨了CuCr合金中组织细化降低截流值的规律。指出触头材料显微组织细化和超细化,是降低CuCr合金截流的一种重要手段。In this paper, a thermodynamic model has been established which deals with the influence of Cr particle size in CuCr vacuum contact alloys on satu-rated vapor pressure and chopping current, and indicates that the refinement of grain size is an important method to reduce chopping current for CuCr alloys.

关 键 词：真空 截流 蒸汽压力 触头材料 电器 

分 类 号：TM503.5[电气工程—电器] TM241[一般工业技术—材料科学与工程]