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作 者:曾绍群[1] 徐海峰[1] 刘贤德[1] 骆清铭[1]
机构地区:[1]华中理工大学光电子工程系
出 处:《华中理工大学学报》1995年第9期6-10,共5页Journal of Huazhong University of Science and Technology
基 金:国防科工委预研基金
摘 要:将非接触热波测试系统与计算机层析技术结合,成功检测出铜样品内部缺陷的分布。在层析成像代数模型基础上,根据热波传输的物理实质及所用实验装置的特点,分别引入几何因子消除探测器有限尺寸效应,引入透射率因子表征孤立缺陷边界对热波的作用,从而建立薪的层析重建模型,实验结果表明,对热性质突变的缺陷,该方法是成功的,带有人为空洞的样品,其内部缺陷的形状和位置得以相当精确的复现,在深度方向重迭的缺陷也得以分辨。实际样品的检测结果也证明了该模型的正确性。最后据实验结果讨论了该模型的局限性。A contactless thermal wave sensing system has been used together withcomputer-basedtomography to successfully determine the distribution of interior defects in Cu specimens. Anew reconstruction model is proposed on the basis of an algebraic tomography model.Ac-cording to the physical essence of the thermal wave and the specific features of the experi-mental setup, a transmissivity and dimension factor each are proposed respectively to de-scribe the effects of the defects on the thermal wave and to compensate for the finite dimen-sions of the detector. It is shown that the model is successful provided that the thermal be-havior of the defects is abruptly different from that of the surroundings. For samples withartificial voids, the position and shape of the subsurface defects can be accurately repro-duced. Defects overlapping in the depth direction can also be recognked. The correctness ofthe model has been proved by the results of the actual sample.The limitations of the modelare discussed.
关 键 词:光热辐射测量 热波 无损检测 缺陷 热波层析成像
分 类 号:TG115.28[金属学及工艺—物理冶金] O432.1[金属学及工艺—金属学]
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