IC芯片引线框骨架精密级进模设计与制造  

Design and Making of Precision Progressive Die for the Lead Wire Framework of IC Chips

作　　者：李学锋[1] 李军[1] 

机构地区：[1]成都航空职业技术学院,四川成都610021

出　　处：《模具工业》2005年第7期21-24,共4页Die & Mould Industry

摘　　要：分析了IC芯片引线框骨架的冲压工艺性,对内外引脚采用分次冲切,确定了合理的工位排样,详细地介绍了模具的总体设计、主要成形零件的设计与制造、计数切断原理及实现间歇定尺寸切断机构的设计。The stamping technique of the lead wire framework of IC chips was analyzed. The inside and outside pins were punched separately. Reasonable service position layout was determfined. General design of the die, the manufacture and design of main forming parts, the principle of countable cutting and the design of the mechanism of cutting by fits in settled measurement were introduced in details.

关 键 词：引线框架 工位排样 模具设计 计数间歇切断 

分 类 号：TG386.41[金属学及工艺—金属压力加工]