锡在反向凝固C／S线中的分布及其对组织与性能的影响  

Distribution of Sn in Cu/Steel Wire and Effect on Microstructure and Properties

作　　者：孙跃军[1] 王晓峰[2] 仲伟深[1] 

机构地区：[1]辽宁工程技术大学材料系,辽宁阜新123000 [2]郑州市职业技术学院

出　　处：《有色金属》2005年第3期21-23,共3页Nonferrous Metals

摘　　要：利用反向凝固技术制备铜包钢电车线试样,分析锡元素在试样中的分布规律,研究锡元素对试样显微组织、硬度、电阻率的影响。结果表明,在反向凝固中,锡可以分布于试样的表面,细化晶粒,提高试样的硬度,同时使电阻率升高。综合考虑电车线的使用性能,以含锡量为0．8％时效果最佳,有应用价值。The samples of copper/steel wire are manufactured by reversing solidification technology, and the tin distribution and the effect on microstructure, hardness, resistivity of the samples are analyzed. The result show that tin is distributed on the surface of the sample made by reversing solidification, and the grain is fined, the hardness and resistivity are increased. Based on the comprehensive property of the copper wire, the optimum content of tin is 0.8 %, and the copper wire with these components will be practically applied.

关 键 词：金属材料 铜包钢电车线 反向凝固 显微组织 硬度 电阻率 锡 

分 类 号：U225.41[交通运输工程—道路与铁道工程] TG113.2[金属学及工艺—物理冶金]