热爆裂法去除SiO_2微粉中的杂质  

Impurity Removement from Fine Silica Powder by Thermal Crack Method

作　　者：李清海[1] 翟玉春[1] 田彦文[1] 赵乃仁[1] 霍玉秋[1] 

机构地区：[1]东北大学材料与冶金学院,沈阳110004

出　　处：《有色金属》2005年第3期41-43,共3页Nonferrous Metals

摘　　要：通过显微镜观察和X-射线衍射分析方法,研究用热爆裂法除去二氧化硅微粉中杂质的过程。结果表明．加热到一定温度后矿物中的包裹体发生爆裂。热爆裂处理后的二氧化硅微粉分别采用超声波水洗和酸洗处理,800℃热爆裂比700℃除杂质效果好,酸洗除杂效果较好于水洗。热爆裂处理过程伴随有二氧化硅粉体的晶型转化。The process of impurity removing from fine silica powders with thermal crack method is investigated by means of DTA and XRD. The results show that the inclusion is cracked while the powder is heated to certain temperature. The cracked silica powder is leached with acid solution or water to remove the impurities, the resuits is better for 800℃ cracking than that 700℃ , and leaching with acid solution is more effective than that with water. The phase transformation of the silica occurs during the treatment with thermal crack method.

关 键 词：无机非金属材料 二氧化硅微粉 热爆裂 除杂质 浸出 

分 类 号：TB383[一般工业技术—材料科学与工程] TF123.9[冶金工程—粉末冶金]