电子束固化三酚基甲烷缩水甘油醚的合成  

The synthesis of 1,1,1-tri-(hydroxyphenyl) methane tri-glycidyl ether being cured by electron beam

作　　者：包建文[1] 李晔[1] 钟翔屿[1] 

机构地区：[1]北京航空材料研究院先进复合材料国防科技重点实验室,北京100095

出　　处：《热固性树脂》2005年第4期1-4,共4页Thermosetting Resin

基　　金：国家自然科学基金资助项目(59833110)

摘　　要：为了获得耐高温电子束固化复合材料环氧树脂基体,研究了三酚基甲烷缩水甘油醚环氧树脂的合成,不同原料配比、合成工艺路线对环氧树脂合成的影响,以及合成环氧树脂的电子束固化树脂的耐热性。研究表明,采用氢氧化钠的饱和碳酸钠溶液作为环氧化反应催化剂和以36%醋酸为洗涤液合成三酚基甲烷缩水甘油醚环氧树脂的路线最合理,合成的树脂经电子束固化后具有与聚酰亚胺树脂相当的耐热性。In order to gain heat-resistant epoxy matrix composites cured by electron beam, the synthesis of tri-（hydroxyphenyl） methane tri-glycidyl ether and the heat-resistance of its cured resin by electron beam were investigated. The synthesis reaction of the epoxy was catalyzed by the saturation solution of sodium carbonate containing sodium hydroxide and the reaction system was washed by 36% acetic acid during the synthesis process. The heat distortion temperature of the tri-（hydroxyphenyl） methanes epoxy cured by electron beam was 367℃ as well as thermosetting polyimide.

关 键 词：环氧树脂 合成 电子束固化 耐热性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]