聚酰亚胺树脂固化动力学参数研究  

Study on curing kinetic parameter for polyimide resin

作　　者：周洪飞[1] 

机构地区：[1]北京航空制造工程研究所,北京100024

出　　处：《热固性树脂》2005年第4期11-13,共3页Thermosetting Resin

摘　　要：采用DSC方法研究PMR型的BMP350聚酰亚胺树脂的固化反应过程。用动态方法分析其固化反应特征温度,为确定固化工艺参数提供了依据。采用Kissinger-Ozawa方法进行数据处理,获得了其固化反应动力学参数,建立了该树脂体系的固化动力学模型,结果表明模型与实验数据在固化度低于0.7时拟合效果较好。此模型对合理地研究PMR型聚酰亚胺树脂体系的工艺参数,保证产品质量以及工艺优化提供了必要的前提条件。Curing reaction process of BMP350 PMR type polyimide resin was studied by DSC. Fixing curing process parameter was based on analysis of characteristic curing temperature by dynamic method. Curing reaction kinetic parameters was obtained by data processed by Kissinger - Ozawa method and modeling the curing kinetics for the resin system and the results showed that it was in a good agreement with the experimental data when the curing degree was below 0.7. The model was important for processing simulation and quality control of processing for high performance composite.

关 键 词：聚酰亚胺树脂 动力学参数 动力学模型 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]