先驱体硅树脂高温连接C_f/SiC复合材料——惰性及活性填料对连接性能的影响  

PYRO-JOINING OF C_f/SiC COMPOSITES VIA PRECERAMIC SILICONE RESIN——INFLUENCE OF INERT AND ACTIVE FILLERS ON JOINING PROPERTIES

作　　者：所俊[1] 陈朝辉[1] 郑文伟[1] 韩卫敏[1] 

机构地区：[1]国防科技大学CFC国防科技重点实验室,长沙410073

出　　处：《复合材料学报》2005年第4期35-39,共5页Acta Materiae Compositae Sinica

基　　金：湖南省自然科学基金(04JJY3002)

摘　　要：对先驱体硅树脂高温转化陶瓷接头连接Cf/SiC复合材料进行了研究。探讨了硅树脂固化裂解过程、惰性及活性填料对连接性能的影响。研究表明,硅树脂的交联固化主要通过消耗Si—OH来完成。适当加入惰性填料SiC(5%,质量分数)或活性填料(纳米Al、Si粉)可以大幅度提高硅树脂对Cf/SiC复合材料的连接性能。The joining of Cf/SiC composites with preceramic silicone resin （SR） at high temperature was studied.The influences of the curing and pyrolysis process of silicone resin and those of the inert and active fillers were especially discussed. The results show that the curing process of SR was accomplished by Si-OH. An appropriate amount of inert filler SiC （5%, mass fraction） or active filler nano-Al/Si powder is good for the joining of Cf/SiC composites.

关 键 词：先驱体 硅树脂 连接 惰性填料 活性填料 

分 类 号：TB332[一般工业技术—材料科学与工程]