镀后处理技术研究及其发展动态  

Technology for Posttreatment of Plating and Its Development Trend

作　　者：韩廷亮[1] 刘钧泉[1] 罗韦因[1] 

机构地区：[1]华南理工大学工业装备与控制工程学院,广东广州510640

出　　处：《材料保护》2005年第8期31-34,共4页Materials Protection

摘　　要：镀后处理在电镀、化学镀、热浸镀等行业中占有重要的地位,对于大多数成熟的表面处理工艺,镀前处理和镀后处理往往是决定产品性能的重要因素。介绍了主要的镀后处理方法即除氢处理和钝化处理,重点介绍了目前研究的各种钝化处理方法,包括无机盐钝化、有机类钝化和有机类与无机盐混合钝化等,指出研究无毒、无污染、性能优良的配方和工艺是钝化处理发展的方向。A review was given on the technology for post-treatment of plating and its development trend. It was pointed out that the posttreatment is very important [WM]in many trades such as electroplating, electroless plating, and hot dipping. This is because the pretreatment and posttreatment are often the essential factors to decide the product performance for most surface treatment technology in mature stage. Moreover, the main methods for posttreatment of plating, i.e., dehydrogenation and passivation were introduced, with the emphasis being placed on various passivating methods including inorganic salt passivation, organic passivation, combined passivation of organic and inorganic salt. It was suggested that chromium-free passivating treatment would find promising application in terms of the development trend, and more attention should be paid to develop nontoxic and non-polluting formulations and technologies for the passivation treatment.

关 键 词：镀后处理 除氢处理 钝化处理 无铬钝化 

分 类 号：TG174.4[金属学及工艺—金属表面处理]