超细钼丝亚硫酸盐脉冲镀金实验研究  

Gilt molybdenum wire for Z-pinch experiment by sulfite pulse gilding technique

作　　者：章志敏 刘德斌[2] 杨向东[1] 邱龙会[2] 付志兵[2] 余斌[2] 

机构地区：[1]四川大学原子与分子物理研究所,四川成都610064 [2]中国工程物理研究院激光聚变研究中心,四川绵阳621900

出　　处：《强激光与粒子束》2005年第7期1027-1030,共4页High Power Laser and Particle Beams

基　　金：国家自然科学基金重点资助课题(10035030);国防科技基础研究基金资助课题

摘　　要：超细钼丝是Z-pinch物理实验常用的材料之一.采用亚硫酸脉冲镀金技术,在超细钼丝上镀制一层均匀致密的金层来改善钼丝性能.实验研究和优化了影响镀层质量和沉积效率的主要工艺条件,优化后的阴极电流密度2 mA/cm2,溶液pH值8.5,溶液温度40°.用扫描电镜观察镀金钼丝的表面形貌及镀层质量;用划痕法测试了镀层与钼丝表面的结合力.实验结果表明,采用经过优化的镀金工艺能够在直径小于15 μm的钼丝上镀制厚度0.6～2.5 μm的致密金层,且能够有效地降低钼丝表面的粗糙度和提高抗氧化能力,满足Z-pinch实验的需要.The ultra-fine molybdenum wire is often used for Z-pinch experiment. To improve the performance of the molybdenum wire, the sulfite pulse gilding technique was used to plate a compact gold layer on the wire. The technological conditions were optimized to ensure the surface quality of the molybdenum wire, including the cathode current density being 2 mA/cm^2 , the pH value of the solution being 8.5, and the temperature of the solution being 40℃. The surface of the molybdenum wire was observed by a scan electron microscope. The bind-force between the gold layer and the molybdenum wire was tested with the nick method. The results show that with the optimized technique the molybdenum wire of less than 15 μm in diameter can be plated with a gold layer of 0.6～2.5 μm thick and the gilt molybdenum wire satisfies the requirements of the Z-pinch experiment.

关 键 词：钼丝 镀层 脉冲镀金 结合力 Z-PINCH 

分 类 号：TQ153.18[化学工程—电化学工业]