电刷镀Cu/Ni纳米多层膜镀液的研究  

The Investigation of Solution For Brush Plating of Cu/Ni Nano–Multilayer Films

作　　者：谭俊[1] 杨红军[2] 郭文才[2] 

机构地区：[1]装备再制造技术国防科技重点实验室,北京100072 [2]装甲兵工程学院装备再制造工程系,北京100072

出　　处：《中国表面工程》2005年第4期27-30,共4页China Surface Engineering

基　　金：国家自然科学基金重点项目(50235030);装备再制造技术国防科技重点实验室基金项目(51489020104JS9102)。

摘　　要：应用扫描电子显微镜(SEM)对电刷镀Cu、Ni薄膜表面形貌进行了观察,并对膜层进行了能谱(EDS)成分分析。结果表明:改变镀液配比和沉积电压,镀层的成分和沉积速率都有明显的变化;在适当的镀液配比下,控制沉积电位,可以分别刷镀出Cu镀层和Ni镀层;控制沉积时间,可以实现纳米多层膜的制备;镀层的生长方式以沿晶外延生长为主,当沉积电压增高时,还伴随有新的晶核的形成和取向择优生长。The morphologies of brush plating Cu and Ni films were observed by scanning electron microscope （SEM） and the film composition was examined by energy dispersive spectroscope （EDS）. The results showed that the film composition is related with the ions ratio of the Cu2 ： Ni2 in the solution and the voltage of deposition. Smooth and dense Cu and Ni film scan be obtained at the appropriate voltage and ions ratio in the solution. Nano-multilayer film can be prepared by controlling the depositing duration. The main growth mechanism of the films is intercrystalline epitaxy, which accompanied the growth of nucleation and orientation when the voltage increases to a certain value.

关 键 词：纳米多层膜 电刷镀 镀液 

分 类 号：TG174.441[金属学及工艺—金属表面处理]