无氰体系中电沉积光亮铜锡合金的研究  

STUDY OF ELECTRODEPOSITING BRIGHT COPPER-TIN ALLOY FROM NONCYANIDE BATH

作　　者：左正忠[1] 侯润香[1] 何细华[1] 

机构地区：[1]武汉大学化学系

出　　处：《武汉大学学报（自然科学版）》1995年第6期659-664,共6页Journal of Wuhan University(Natural Science Edition)

摘　　要：提出了一种无氰电沉积光亮铜锡合金的新工艺．其溶液组成及操作条件为：Ｎａ３Ｃ６Ｈ５Ｏ７·２Ｈ２Ｏ９０～１２０，Ｎａ２ＥＤＴＡ·２Ｈ２Ｏ２５～３５，稳定剂ＷＤＺ－９４３１０～１５，ＣｕＳＯ４·５Ｈ２Ｏ２０～４０，ＳｎＣｌ２·２Ｈ２Ｏ２０～４０ｇ·Ｌ－１；溶液的ｐＨ＝５～６，Ｄｋ＝１０～１５０Ａ·ｍ－２，Ｔ＝５０～６０℃．在上述条件下可获得含锡量为５％～１５％的光亮、细致、均匀的铜锡合金沉积层．还讨论了溶液的温度、阴极电流密度对合金沉积层中锡量以及阴极电流效率的影响．A new process of electrodepositing of bright Copper-Tin alloy from noncyanide bath is proposed in this paper. The bath composition and operating conditions are Na3C6H5O7· 2H2O 90～120,Na2EDTA· 2H2O 25～35,stabilizer WDZ-943 10～15,CuSO4·5H2O 20～40,SnCl2· 2H2O 20～40 g· L-1;pH=5～6,Dk=10～150A· m-2 ,T=50～60 C.A bright,fine and well-distributed Cu-Sn deposit having Sn about 5%～15% is produced.Effects of bath temperature and current density on Sn content in deposit,cathode current efficiency are also discussed.

关 键 词：电沉积 铜锡合金 无氰电沉积 氰化物 

分 类 号：TQ153.2[化学工程—电化学工业]