大理石切割过程研究  

Cutting Process of Marble

作　　者：郭柏林[1] 卢洁明[1] 

机构地区：[1]武汉工业大学机械工程系

出　　处：《武汉工业大学学报》1995年第2期75-78,共4页

摘　　要：本文从大理石宏观、微观物理力学性质分析入手，以损伤力学理论为基础，利用扫描电镜对大理石切断面进行了深入分析，提出大理石切割过程为：微裂纹成核和原生微裂纹产生应力集中；微裂纹扩展、贯穿、交汇；切屑去除三个过程。大理石切割机理为脆性破坏。In this paper,starting with analysis of macro and micro physicomechanical properties of marble,on the basis of damage mechanics theory, marble cutting faces are analyzed deeply by means of scanning electron micrescope,and marble cutting process is divided into three stages-microrack cored and stress concentration on the primary microcrack, growth, ponetration and intersection of microcrack and the removal of chips. Brittle damage is regarded as cutting mechanism of marble.

关 键 词：微裂纹 断裂 大理石 切割 

分 类 号：TU564.2[建筑科学—建筑技术科学]