双材料板条的界面应力问题─温度沿板厚呈线性分布的情况  

Interfacial Stresses Problem in Bimaterial Strips StructureWhen Temperature Distributes along Cross-Sections in linearity

作　　者：蔡乾煌[1] 

机构地区：[1]清华大学

出　　处：《应用力学学报》1995年第4期99-102,共4页Chinese Journal of Applied Mechanics

基　　金：国家自然科学基金

摘　　要：本文给出双材料板条结构的Ｓｕｈｉｒ界面应力微分方程一般解，进而求解了温度沿板厚呈线性分布时因异材失配引起的界面剪应力和剥离应力，此解包含了均匀升温情况下的Ｓｕｈｉｒ解。A general solution for Suhir's interfacial stresses differential equation is given and used in solvingfor the interfacial shear and peeling stresses in thermally-mismatched strips structure when tempera-ture distributes along the cross-sections of strips in linearity.These solutions can be reduced to Suhiri'ssolutions if temperature change is uniform.

关 键 词：双材料 板条 热失配结构 界面 应力 温度分布 

分 类 号：O343.6[理学—固体力学]