低碳含金阳极帽封接气泡的产生与控制  

The Bubble Production and Control in the Processing of Low Carbon Alloy Anode Button Sealing

作　　者：安白[1] 马莒生[1] 汪刚强[1] 唐祥云[1] 

机构地区：[1]清华大学材料系

出　　处：《真空电子技术》1995年第3期40-43,47,共5页Vacuum Electronics

摘　　要：本文研究低碳封接合金阳极帽产生封接气泡的原因及控制措施。结果表明，低碳含金阳极帽产生封接气泡，主要是由于氧化膜破损和封接温度偏高造成，其实质是由于氧化膜表面因破损产生凹坑、膜上附着物等缺陷，封接时这些地方吸附的气体未能逃逸形成了气泡。通过降低封接温度和控制送料斗振动强度的措施，基本解决了封接气泡大量产生的问题。The bubble production and control in the processing of low carbon alloy anode button have been studied. It is shown that the oxide film breakage on the surface of anode button and high sealling temperature will produce the sealing bubble. During the processing, the gas absorbed in the oxide film could not escape, therefore, to form the bubbles. Lower the sealing temperature and the vibration strength of the button-sending machine, the numbers of bubbles are reduced greatly.

关 键 词：封接气泡 封接合金 电真空元器件 低碳合金 

分 类 号：TN105[电子电信—物理电子学]