共晶烧结技术的实验研究  

The Research of Eutectic Die Attachment Technology

作　　者：姜永娜[1] 曹曦明[1] 

机构地区：[1]中国电子科技集团公司第13研究所,石家庄050051

出　　处：《半导体技术》2005年第9期53-56,60,共5页Semiconductor Technology

摘　　要：随着微波混合集成电路向着高性能、高可靠、小型化、高均一性及低成本方向的发展,对芯片焊接工艺提出了越来越高的要求。本文对几种共晶烧结方法进行了实验比较,讨论了各种方法的适用范围,影响质量的因素并对实验结果进行了简单的讨论。Along with microwave mixture IC is evolving toward the direction of high performance, high reliability, miniaturization, high uniformity and low cost, the demand to arts and crafts of chip joint is increasingly high. Several kinds of arts and crafts of eutectic die attachment are compared, the different application scope is discussed, the specific factors of impact IC quality is analyzed, some simple discussions and summary to experiment results are given.

关 键 词：共晶 烧结 工艺 微波混合集成电路 

分 类 号：TN305[电子电信—物理电子学]