脉冲电镀的研究现状  

Current Status of Pulse Plating Research

作　　者：刘勇[1] 罗义辉[1] 魏子栋[1] 

机构地区：[1]重庆大学化学化工学院,重庆400044

出　　处：《电镀与精饰》2005年第5期25-29,共5页Plating & Finishing

摘　　要：介绍了脉冲电镀的工作原理、特点、波形种类等,回顾了近几年来脉冲电镀在镀锌、镀铬、镀镍、镀铜、镀金、镀银及其合金等领域的应用研究现状,以及脉冲电镀在印刷电路板微孔镀铜、制造纳米晶、纳米多层膜等新兴领域的应用研究,并对脉冲电镀今后的发展前景作了展望。The principle, characteristics and techniques of pulse plating were introduced. The application status of pulse current plating in zinc, chromium, nickel, copper, gold, silver and their alloy plating were summarized. In addition, the copper plating with pulse current in printing circuit hoard to produce nano particle and nano multilayer films were also discussed. The developing trend of pulse plating was previewed.

关 键 词：脉冲电流 电镀 纳米晶 

分 类 号：TQ153[化学工程—电化学工业]