低温固体界面热阻三维可视化仿真  

Visual Simulation of Three Dimension Interfacial Thermal Resistance Between Solids at Low Temperature

作　　者：陈进[1] 崔晶晶[1] 王惠龄[2] 许建凤[1] 王建[2] 

机构地区：[1]武汉理工大学自动化学院,武汉430070 [2]华中科技大学制冷与低温工程研究所,武汉430074

出　　处：《武汉理工大学学报》2005年第9期17-19,共3页Journal of Wuhan University of Technology

基　　金：国家自然科学基金(51076013);教育部博士基金课题(20040487039).

摘　　要：提出低温固体界面传热的可视化仿真,将固体界面传热微观过程和宏观参数计算可视化。采用VC++6.0工具设计了界面传热的可视化仿真软件,基于Bi2223与氮化铝陶瓷(AlN)界面热阻低温实验数据,导入仿真软件,得到Bi2223与氮化铝陶瓷(AlN)界面传热的可视化仿真图和仿真曲线,用仿真手段探索三维界面层传热的微观机理。The process of heat transfer between .solids at low temperature was simulated by the visual simulation of computer. The visual simulation .software of three dimension interracial thermal resistance was designed by the computer program tool of VC ＋ ＋ 6.0. When the data, which was .sampled in the cryogenic experiment of three-dimension interfacial thermal resistance between AIN and Bi2223, input into the software, the visual simulation curve and graph were displayed on the computer. The micro mechanism of heat transfer between .solids was discovered by means of computer simulation.

关 键 词：三维界面热阻 低温传热 可视化仿真 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]