纳米晶CuCr合金的制备及其截流值研究  

Preparation of Nanocrystalline CuCr Contact Materials and Their Chopping Currents

作　　者：冯宇[1] 张程煜[1] 丁秉钧[1] 

机构地区：[1]西安交通大学,陕西西安710049

出　　处：《稀有金属材料与工程》2005年第9期1439-1442,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金资助项目(50071043)

摘　　要：通过高能球磨和真空热压技术制备了致密度大于98%的纳米晶CuCr合金,通过XRD,SEM和TEM研究了其显微组织和结构.结果表明,其晶粒尺寸小于50 nm.在模拟电路上研究了其真空电弧稳定性和截流值,纳米晶CuCr合金的真空电弧稳定性好于常规CuCr合金,其截流值为常规CuCr合金的17%～35%.Nanocrystalline CuCr alloys with a relative density of above 98% can be prepared by high energy ball milling and hot pressing technique. The grain size of nanocrystalline CuCr alloy is less than 50 nm. The vacuum arc instability and chopping current of nanocrystalline CuCr materials were studied in an artificial circuit. The results show that the vacuum arc of nanocrystalline CuCr is more stable than that of conventional materials, the chopping current is 17%-35 % of that of conventional alloys.

关 键 词：纳米晶CuCr 触头材料 截流值 

分 类 号：TB383[一般工业技术—材料科学与工程]