低压片状模塑料增稠工艺研究  

Research on Thickening Process of Low Pressure Sheet Molding Compound

作　　者：黄志雄[1] 于浩[1] 秦岩[1] 

机构地区：[1]武汉理工大学材料科学与工程学院,湖北武汉430070

出　　处：《塑料工业》2005年第10期31-33,共3页China Plastics Industry

基　　金：国家"863"项目(2003AA333070)

摘　　要：采用氧化镁为增稠剂、结晶树脂以粉料形式加入而降低片材热模内粘度的工艺,改进了对低压片状模塑料的增稠方法。结果表明:采用此工艺,设备不需要加热,增稠符合传统SMC增稠曲线;片材在模腔内有较低的粘度,适宜于低压成型。MgO was used to thicken the low pressure sheet molding compound and crystalline unsaturated polyester was grinded into powder to regulate the viscosity in cavity of hot mold in this process. By means of this method, the SMC equipment was not need an accessional calefaction device and the thickening curve was in accord with the traditional one thickened by single MgO. The sheet molding compound had an appropriate low viscosity to be molded at low pressure.

关 键 词：低压片状模塑料 增稠 结晶树脂 粉料 热模粘度 

分 类 号：TQ327.7[化学工程—合成树脂塑料工业]