Al-35Si 高硅铝合金热变形行为的研究  

Study of the Hot Deformation Behavior of the Al-35Si High Silicon Aluminum Alloy

作　　者：张伟[1] 杨伏良[1] 甘卫平[1] 欧定斌[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《材料导报》2005年第10期136-138,共3页Materials Reports

基　　金：[军工项目]国防科学技术工业委员会资助项目 MKPT-03-151

摘　　要：采用 Gleeble-1500热模拟机对电子封装用 Al-35Si 高硅铝合金进行了恒温和恒应变速率下的热压缩变形实验,温度范围为370～550℃,应变速率为0.05～0.45s^(-1),得到了其真应力-真应变曲线。结果表明:在实验范围内,此合金的流变应力随变形温度的升高、应变速率的降低而降低,在不同变形条件下真应力软化机制分别受动态回复和动态再结晶控制,并且应变速率敏感性指数 m 随温度的升高呈上升趋势。Hot compressive deformation of Al-35Si high-silicon aluminum alloy is tested by using Gleehle-1500 thermal simulator at constant temperatures and constant strain rates. The ranges of temperature and strain rate are 370～550℃ and 0. 05～0. 45s^-1 respectively. The compressive true stress vs true strain curves are obtained. The results show that the flow stress decreases with the increase of deforming temperature, while increases with the increase of strain rate;the softening mechanism is dominated by dynamic recrystallization and dynamic recovery at different conditions; The sensitivity exponent of strain rate is increased with raising of deformation temperature.

关 键 词：电子封装 高硅铝合金 热压缩变形 流变应力 应变速率敏感指数 热变形行为 应变速率敏感性指数 恒应变速率 变形实验 温度范围 

分 类 号：TG146.21[一般工业技术—材料科学与工程] TQ323.4[金属学及工艺—金属材料]