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作 者:吴玮巍[1] 蒋益明[1] 郭峰[1] 钟澄[1] 刘平[1] 李劲[1]
出 处:《化学学报》2005年第20期1913-1916,共4页Acta Chimica Sinica
基 金:国家自然科学基金(No.10374015);上海市纳米专项(No.0452nm004);国家重点基础研究发展计划(973计划)(No.2002CB613504)资助项目.
摘 要:采用真空蒸发方法制备了Cu/TCNQ金属机双层膜.系统研究了湿度对CuTCNQ络合物形成过程的影响规律,结果表明湿度对膜的化学反应传质过程有明显加速作用.过程机制在干燥条件与湿度作用条件下有本质不同:前者为固体化学扩散机制,而后者为水溶液电化学反应机制.进一步深入分析传质时间与湿度的关系后发现,湿度条件下薄膜对水分子的吸附是反应传质速度的控制步骤.A Cu/TCNQ metal-organic thin film was prepared by vacuum deposition. The influence of humidity on chemical transport behavior in the film was studied. The results show that the transport is obviously accelerated by environmental humidity. The transport mechanism in the film in dry and wet air was essentially different. The CuTCNQ complex was formed respectively through solid chemical transport in dry environment and electrochemical reaction in aqueous solution in wet environment. The adsorption of H2O molecules on the film is found to be the control step of the transport under the wet condition.
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