Cu-Mn化学镀层对Q235的扩散焊接强度的影响  

Effect of electroless Cu-Mn coating on diffusion welding strength of Q235 material

作　　者：彭成章[1] 陈安华[1] 王文明[1] 

机构地区：[1]湖南科技大学机械设备健康维护省重点实验室,湖南湘潭411201

出　　处：《湖南科技大学学报（自然科学版）》2005年第3期23-25,共3页Journal of Hunan University of Science And Technology：Natural Science Edition

摘　　要：采用化学镀工艺,在Q235基材上制备出2～4 μm的Cu-Mn合金化学镀层.在650℃～870℃温度范围内对化学镀层进行了真空扩散焊接试验.利用金相和扫描电镜对接头进行了微观组织和能谱分析,并用拉伸试验评价了接头的连接强度.研究结果表明,在相同工艺参数条件下,镀有Cu-Mn化学镀层的试件其剪切强度比无镀层试件提高1倍以上;高温扩散焊接时接头的连接强度提高,但基体组织比低温扩散焊接时显著粗化.图3,表2,参7.Electroless Cu - Mn alloy coating with 2 - 4μm thickness was prepared on surface of matrix Q235 by electroless plating technology. Vacuum diffusion welding experiments on Q235 with Cu - Mn coating were carried out within 650 -870 ℃ temperature. The interface structure, chemical component and bonding strength of joints were investigated by metalloscope and SEM. The results show that shearing strength of joints with electroless Cu - Mn coating is nearly two times greater than that without coating under the same condition of welding process, and increases with welding temperature, but the grains of matrix Q235 are coarsened during welding process in high temperature. 3figs. , 2 tabs. , 7 refs.

关 键 词：化学镀 扩散焊接 剪切强度 快速成形 

分 类 号：TG153.2[金属学及工艺—热处理]