高速高密度PCB设计中电容器的选择  

How to Select Capacitor in High-speed and High- density PCB Design

作　　者：周胜海[1] 涂有超[1] 

机构地区：[1]河南信阳市长安路信阳师范学院物理与电子工程学院,副教授464000

出　　处：《微计算机信息》2005年第10Z期141-143,共3页Control & Automation

基　　金：河南省自然科学基金资助项目(0311012500)

摘　　要：电容器在电子电路中有重要而广泛的用途。与传统的PCB设计相比,高速高密度PCB设计面临很多新挑战,对所使用的电容器提出很多新要求。此外,电容器技术和高速高密度PCB设计技术又都在不断发展。因而在高速高密度PCB设计中,电容器的选择是一个值得研究的问题。结合高速高密度PCB的基本特点,分析了电容器在高频应用时主要寄生参数及其影响,指出了需要纠正或放弃的一些传统认识或做法,总结了适用于高速高密度PCB的电容器的基本特点,介绍了适用于高速高密度PCB的电容器的若干新进展。Capacitors are common component of electronic circuits. Compared with the ordinary PCB design, the high-speed and hlgh-density PCB design is faced with new challenges and needs better performance of capacitors used in it. In addition, both the techniques for capacitors and the techniques for highspeed and high-density PCB design are making advances continually. So how to select capacitors for high-speed and highdensity PCB is worth research. The main parasitic parameters and their ill consequences of capacitors at high frequency are discussed, some important misunderstandings pointed out, the common features of capacitors used in high-speed and highdensity PCB outlined, and some relevant new techniques for capacitors introduced.

关 键 词：高速高密度PCB 电容器 等效串联电阻 等效串联电感 自谐振频率 微型化 

分 类 号：TN41[电子电信—微电子学与固体电子学] TP33[自动化与计算机技术—计算机系统结构]