表面机械研磨处理的纯铜拉伸形变机制  

Tensile deformation mechanism in pure copper subjected to surface mechanical attrition treatment

作　　者：邢长海[1] 王科[2] 刘刚[1] 吴世丁[1] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家(联合)实验室 [2]太原理工大学

出　　处：《材料研究学报》2005年第5期531-536,共6页Chinese Journal of Materials Research

摘　　要：采用扫描电镜电子通道衬度技术(SEM-ECC)研究了表面机械研磨处理(SMAT)铜表面在室温拉伸的形变特征.结果表明:剪切带是纳米晶层、亚微晶层以及由位错胞组成的过渡层的共同形变特征,在不同的结构表层,剪切带的形貌略有差别.纳米晶层和亚微晶层内的剪切带主要为沿平面界面剪切滑动的结果,而过渡层的形变主要是以SMAT处理前的初始晶粒为单元发生的,剪切带的形成基本符合晶体学规律.The ambient tensile deformation characteristics of copper subjected to the surface mechanical attrition treatment （SMAT） was investigated by means of the electron channeling contrast in scanning electron microscopy （SEM-ECC）. It was found that during tensile the shear bands were the common deformation characteristics in nano-grained layer, submicro-grained layer and transition layer formed by dislocation cells. The morphology of the shear bands slightly varied in the surface layer with different structures. The shear bands both in nano-grained layer and submicro-grained layer were formed as a result of the shear sliding along a planar interface. The tensile deformation in transition layer mainly occurred in a scale of the original grains. The shear bands were formed basically according with the rule of crystallography.

关 键 词：金属材料 表面机械研磨处理 变形机制 纯铜 扫描电子显微镜电子通道衬度(SEM-ECC) 

分 类 号：TG113[金属学及工艺—物理冶金]