电流对Al-4.5%Cu合金定向凝固枝晶间距的影响  

Effect of Electric Current on Dendrite Spacing During Al-4.5%Cu Alloy Directional Solidification

作　　者：万刚[1] 武保林[1] 赵玉华[1] 徐前刚[1] 

机构地区：[1]沈阳航空工业学院材料工程系,辽宁沈阳110034

出　　处：《铸造》2005年第11期1066-1068,共3页Foundry

摘　　要：对Al-4.5%Cu合金凝固的一次枝晶间距计算公式进行了讨论,并结合定向凝固条件,研究各种条件参数对计算结果的具体影响。结果表明:只有当电流在一定的范围(即J>J1)取值时,一次枝晶间距才随着电流的增大而减小,否则随电流的增加而增大.此外,如果计算中考虑Thomson效应,电流对枝晶间距的影响规律并没有改变,只是相应电流的取值范围变窄了(即J1减小)。The calculation formulation of primary dendrite spacing for A1-4.5%Cu alloy is discussed in this paper, and combining the directional solidification conditions, the effects of different parameters on calculation results are studied too. The results show that the dendrite spacing will be reduced with increasing of electric current only when the span of electric current is in a special interval （i.e. J〉J1）, or the spacing will be increased with increasing of electric current. And the experiment results verified this too. Furthermore, if the Thomson effect is considered during calculation, the rule of current affecting dendrite spacing does not has change but the span of current choosing becomes smaller （i.e. J1 reduced）.

关 键 词：电流 定向凝固 一次枝晶间距 Thomson效应 

分 类 号：TG111.4[金属学及工艺—物理冶金]