合金凝固过程再辉现象的数值模拟  

Numerical Simulation of Recalescence During Alloy Solidification Process

作　　者：龙文元[1] 蔡启舟[2] 魏伯康[2] 陈立亮[2] 

机构地区：[1]南昌航空工业学院材料科学与工程学院,江西南昌330034 [2]华中科技大学材料科学与工程学院,湖北武汉430074

出　　处：《铸造》2005年第11期1097-1100,共4页Foundry

基　　金：国家自然科学基金项目(10176009);江西省材料科学与工程研究中心开放项目(ZX200301017)。

摘　　要：本文采用二元合金的等温相场模型,在假定温度在计算区域空间上保持一致的情况下耦合计算热平衡方程,以Al-4.5%Cu合金为例模拟了在不同冷却速率下二元合金凝固过程的枝晶生长过程及其再辉现象。结果表明:利用相场模型可以逼真地模拟二元合金过冷熔体中的枝晶生长过程,与试验得到的枝晶形貌吻合较好;凝固潜热和冷却速率显著影响枝晶的生长行为,再现其凝固过程的再辉现象,模拟的结果与经典枝晶生长理论相吻合。The recalescence and the dendritic growth during A1-4.5% Cu binary alloy solidification processes are simulated under different cooling rates using the isothermal phase-field model, which is coupled with a heat balance which neglects temperature variations in space. The results show that the dendrite growing morphologies could be simulated realistically by using the new phase-field method; The results of simulation are agree well with the experiment; The latent heat and the cooling rate influence the dendritic growth obviously, and the recalescence of alloy solidification process is showed; Simultaneously the simulation results are agree well with the dendritic growth theory.

关 键 词：相场法 二元合金 再辉现象 

分 类 号：TG27[金属学及工艺—铸造] TP15[自动化与计算机技术—控制理论与控制工程]