W-Cu梯度热沉材料的成分与结构设计  

Design of Component and Structure for Tungsten/Copper Heat-Sink Gradient Materials

作　　者：刘彬彬[1] 谢建新[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《稀有金属》2005年第5期757-761,共5页Chinese Journal of Rare Metals

基　　金：国家杰出青年科学基金资助项目(50125415)

摘　　要：采用数值模拟的方法,分析了三层梯度结构W-Cu材料各层成分与厚度对制备过程中所产生的热应力的影响;对于四层、五层结构的W-Cu梯度材料,分析了各层等厚结构时的成分分布与热应力的关系。结果表明:三层梯度结构W-Cu材料的各层厚度发生变化时,中间过渡层的最佳成分不同;均厚的三层结构应力缓和效果最好;随着梯度结构层数的增加,应力缓和效果增强,但增强的趋势由明显变为平缓。The effect of structure and component on thermal stress during fabricating process of three-layer W-Cu gradient materials is analyzed by FEM. Additionally, the relations between the component distribution and thermal stresses of four-layer and five-layer tungsten/copper FGMs with equal layer thickness are also analyzed. The results show that the optimal component design of the transitional layer changes with the structure of FGMs, and the structure, 0. 5 mm/0. 5 mm/0. 5 mm, can obtain the best effect. With the increase of the gradient layer number, the effect of thermal stress mitigation is more obvious, but the trend becomes smooth.

关 键 词：钨铜复合材料 热沉 功能梯度材料 应力缓和 残余应力 

分 类 号：TN104.1[电子电信—物理电子学]