铝合金化学镀Ni-P-B的研究  

Study of electroless Ni-P-B plating on aluminium alloys

作　　者：康忠明[1] 彭秋波[1] 代明江[1] 况敏[1] 

机构地区：[1]广州有色金属研究院表面中心,广州510651

出　　处：《电镀与涂饰》2005年第2期11-14,共4页Electroplating & Finishing

摘　　要：以二甲基胺硼烷(DMAB)为还原剂,在铝合金上获得了化学镀镍低磷低硼镀层,研究了硫酸镍、次磷酸钠、 DMAB、络合剂、pH值和稳定剂对镀层的沉积速度、显微硬度和微观形貌的影响。通过正交实验和单因素实验,确定了最 佳工艺配方为:24 g／L硫酸镍,适量DMAB,12 g／L次磷酸钠,3 mg／L硫脲,30 mL／L络合剂。所获得的化学镀镍镀层中 P、B、Ni的质量分数分别为:1.81％、0.26％和97.93％。该镀层与基体的结合力良好,硬度在550～710HV范围内,在铝 质活塞上应用获得了满意的效果。A kind of electroless nickel plating deposits with low content of phosphor and boron on aluminium alloys were obtained with boron dimethylamine complex （DMAB） as reducer. The influences of nickel sulfate, sodium hypophosphite, DMAB, complexant, pH value and stabilizer on deposition rate, micro - hardness and micro - structure were studied , The formula was optimized by orthogonal test and single factor test as follows ：24 g/L nickel sulphate, 12 g/L sodium hypophosphite , suitable addition amount of DMAB, 3 mg/L thiourea , 30 mg/L complextant. The weight percent of P, B, Ni in the deposits were 1.81%, 0.26 % and 97,93% respectively. The deposits have good adhesion to substrate and its micro-hardness is between 550 HV to 710 HV .The deposits have been successfully applied to aluminium piston.

关 键 词：铝合金 化学镀Ni-P-B 二甲基胺硼烷(DMAB) 正交实验 

分 类 号：TQ153.12[化学工程—电化学工业]