纳米二氧化硅对镍电沉积影响及在复合镀层中的化学键合状态  

Effect and Chemi and of n-SiO2 on Electrodeposition of Nickel cal Bonding Interaction between Nanoparticles Matrix Metal in the Composite Coating

作　　者：涂伟毅[1] 徐滨士[1] 董世运[1] 蒋斌[1] 杜令忠[1] 胡振峰[1] 

机构地区：[1]装甲兵工程学院装备再制造技术国防科技重点实验室

出　　处：《电刷镀技术》2005年第3期6-11,共6页

摘　　要：用线性扫描伏安法和电位阶跃法研究了n-SiO2／Ni复合电刷镀体系的电化学响应，探讨了纳米颗粒的影响；用X射线光电子谱研究了复合镀层中n-SiO2／Ni颗粒表面与基质金属间的相互作用，结果表明纳米颗粒使金属沉积过电位显著降低，电流效率、金属成核率及晶体生长速度增加，纳米颗粒对金属镍电结晶有明显的催化效应；n-SiO2／Ni表面氧的不饱和化学键与表面扩散过程中吸附态金属Ni原子键合形成Ni—O键，纳米颗粒与基质镍以化学键方式结合。The electroche mical response form n-SiO2/Ni composite brush plating system was researched by means of cyclicvoltammetry and potential step. The interaction between nanoparticles and matrix metal nickel was investigated by X - ray photoelectron spectrometry, The results show that nanoparticles lead to increasing of the current efficiency, ratio of nucleation and crystal growth rate as well as decreasing of overpotential. Nanoparticles can catalyze the nickel electrodeposition and reduce the size of metal crystal. As the nickel atoms reduced on cathode are diffusing on the metal growth surface, the unsaturated bond of oxygen atoms on nanopartlele surface can capture some of the absorbed nickel atoms and form nickel-oxygen chemical bond. It is proved that the chemical bonding interaction exists on the interlace between nanopartlcle surface and matrix metal nickel.

关 键 词：纳米颗粒 复合电沉积 化学键合 共沉积机理 复合镀层 纳米二氧化硅 金属镍 电沉积 线性扫描伏安法 X射线光电子谱 

分 类 号：TQ153[化学工程—电化学工业]