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机构地区:[1]Key Laboratory for Superfine Materials of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237 [2]SVA Electron Co. Ltd., Shanghai 200081
出 处:《Chinese Physics Letters》2005年第11期2947-2949,共3页中国物理快报(英文版)
摘 要:A new stacking method via variation ofsubstrate temperature in rfmagnetron sputter is used to fabricate polycrystalline/polycrystalline Ba0.5Sr0.5TiO3 thin films with higher dielectric constant, higher breakdown strength and lower leakage current densities than those prepared by a conventionM deposition method. The improved figure of merit G (ε0εrEb) of the Ba0.5Sr0.5TiO3 thin films implies that they are a feasible insulation layer for thin film electroluminescent devices.A new stacking method via variation ofsubstrate temperature in rfmagnetron sputter is used to fabricate polycrystalline/polycrystalline Ba0.5Sr0.5TiO3 thin films with higher dielectric constant, higher breakdown strength and lower leakage current densities than those prepared by a conventionM deposition method. The improved figure of merit G (ε0εrEb) of the Ba0.5Sr0.5TiO3 thin films implies that they are a feasible insulation layer for thin film electroluminescent devices.
关 键 词:TUNABILITY DEVICES LAYER
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