Q235钢表面化学镀Ni-Cu-P的研究  

Research on the Ni-Cu-P Electroless Plating on Q235 Steel

作　　者：刘琛[1] 

机构地区：[1]陕西理工学院材料科学与工程系,陕西汉中723001

出　　处：《铸造技术》2005年第11期1012-1014,1019,共4页Foundry Technology

基　　金：陕西省自然科学研究项目"纳米晶体热稳定性研究"(2003E120)

摘　　要：用正交设计研究了Q235钢表面化学镀Ni-Cu-P工艺对镀层质量、组织结构和性能的影响规律。结果表明:各因素对化学镀沉积速率影响的显著性顺序是:镍磷比>pH值>硫酸铜加入量>施镀温度>柠檬酸钠加入量;实验条件下,较好的施镀工艺为:温度75℃,镍磷比0.25,pH值10.0,柠檬酸钠50 g/L;硫酸铜1.0 g/L;镀层显微硬度为Q235钢基体硬度的2.8倍,获得了磷含量超过11%的非晶镀层。Effect of Ni-Cu-P electroless plating process on Q235 steel upon guality, structure and property of this deposited film are systematically studied by orthogonal experiment design. The result shows that： The significance influence on the film net mass of the factors decreases according to the order. [Ni^2＋]/[H2PO2 ratio〉pH〉copper sulfate〉plating temperature〉Na3C6H5O7 · 2H2O（Complex compound）; The better Ni-Cu-P electroless plating processing in this experimental conditions is proposed as follows： plating temperature of 75℃,[Ni^2＋]/[H2PO2^-] ratio of 0. 25 （ NiSO4· 6H2O of 30 g/L, NaH2PO2 · H2O of 45 g/L）,phof 10.0, Na3C6H5O7 · 2H2O of 50 g/L and copper sulfate of 1.0g/L; Under the optimal operating conditions of the scheme, the microhardness of the plating film was 2.8 times as hard as that of Q235 steel and the experiment gets non-crystal plating film of exceeding 11% P.

关 键 词：Q235钢 化学镀 施镀工艺 

分 类 号：TQ153[化学工程—电化学工业]