Ti-Si-N纳米复合薄膜的结构与性能  

Structure and Properties of Ti-Si-N Nanocomposite Films Prepared by Pulsed-DC Plasma Enhanced CVD

作　　者：牛新平[1] 马大衍[1] 马胜利[1] 徐可为[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室,陕西西安710049

出　　处：《稀有金属材料与工程》2005年第11期1751-1753,共3页Rare Metal Materials and Engineering

基　　金：国家自然科学基金项目(50271053;50371067);国家自然科学基金委重大国际合作项目(50420130033);科技部"973"重大基础研究计划项目(2004CB619302);教育部新世纪优秀人才支持计划项目(NCET-04-0934)的共同支持

摘　　要：用工业型脉冲直流等离子体增强化学气相沉积技术,在高速钢(W18Cr4V)表面沉积了Ti-Si-N复合薄膜,研究了Ti-Si-N复合薄膜的微观组织和力学性能.结果显示,薄膜相结构为纳米晶TiN和纳米晶或非晶TiSi2以及非晶相Si3N4;在Si含量为5.0 at%～28.0 at%范围内,薄膜的晶粒尺寸逐渐变大;Ti-Si-N薄膜的显微硬度相对于TiN有明显增加,最高硬度可达40 GPa;高温退火后,Ti-Si-N纳米复合薄膜的显微硬度与晶粒尺寸在800℃高温下仍然保持稳定.Nanocomposite thin films composed of nano-crystalline TiN and nanosized amorphous Si3N4 were deposited on W18Cr4V substrate using an industrial set-up of pulsed-DC plasma enhanced chemical vapor deposition technique. The microstructure and the mechanical properties of Ti-Si-N films was explored. Results show that the crystallite size increas with the increasing of silicon content, and the micro-hardness of Ti-Si-N film increas at a range of silicon addition, the maximal hardness of films was 40.0 GPa. Furthermore, the micro hardness and crystallite size （measured at room temperature） remain stable up to high temperature of 800℃.

关 键 词：TI-SI-N 纳米复合薄膜 晶粒尺寸 显微硬度 

分 类 号：TB383[一般工业技术—材料科学与工程]