混合硅酸盐无机胶粘剂的研制  

Development of a compound silicate inorganic adhesive

作　　者：刘成伦[1] 徐锋[1] 

机构地区：[1]重庆大学化学化工学院

出　　处：《中国胶粘剂》2005年第11期19-22,共4页China Adhesives

基　　金：重庆市高等学校优秀中青年骨干教师资助计划。

摘　　要：采用正交试验和改变加料量试验相结合的方法研制了一种满足陶瓷粘接和修复要求的硅酸盐系无机胶粘剂。采用电子精密材料试验机测试其粘接力及常温水浸实验测其耐水性和高温灼烧骤冷检测其抗热震能力。结果表明,该胶粘剂粘接陶瓷拉伸强度大、抗热震性能好,且具有室温即可固化、易于施工、原料易得和价格低廉的特点。A compound silicate inorganic adhesive has been developed by choosing the optimization stuffs based on the orthogonal experiment. It adapted to achieve adhesion and restoration of ceramil. The performances of inorganic adhesive are analyzed in this paper. The results show that the adhesive has a good bonding strength ,water resistance and thermal shock. Moreover, in the room temperature. At the same time, its price is low and the it is easy to be cured and constructed raw material is easy to get.

关 键 词：胶粘剂 硅酸盐胶料 粘接强度 耐水性 热震性 陶瓷 

分 类 号：TQ433.52[化学工程]