基于制造成品率模型的集成电路早期可靠性估计  

Estimation of Early-Life Reliability Based on Integrated-Circuit Yield Model

作　　者：赵天绪[1] 段旭朝[1] 郝跃[2] 

机构地区：[1]宝鸡文理学院计算信息研究所,陕西宝鸡721007 [2]西安电子科技大学微电子所,陕西西安710071

出　　处：《电子学报》2005年第11期1965-1968,共4页Acta Electronica Sinica

基　　金：陕西省自然科学基金(No.2002F30);陕西省教育厅科研计划项目(No.02JK194)

摘　　要：缺陷是影响集成电路成品率与可靠性的主要因素.本文在区分缺陷与故障两个概念的基础上,将缺陷区分为成品率缺陷(硬故障)、可靠性缺陷(软故障)和良性缺陷.利用关键区域的面积,给出了一个缺陷成为“硬故障”或“软故障”的概率,给出了精度较高的IC成品率预测模型.利用成品率缺陷与可靠性缺陷之间的关系,给出了工艺线生产的产品的失效率与该工艺线制造成品率之间的定量关系.在工艺线稳定的条件下,通过该工艺线的制造成品率可以利用该关系式可以有效的估计出产品的失效率,可以有效地缩短了新产品的研发周期.The defect is a main factor of affecting IC＇ s yield and reliability. Defects can be divided into yield defects （hard faults）, reliability defects （ soft faults） and goodness defects based on the difference between the defect＇ s concept and fault＇ s concept. The probability of a defect being a hard fault or a soft fault by the critical area of a defect is given and a more accurate yield model is gotten. A quantitative expression between IC＇ s failure probability and functional yield is obtained by the relationship between the yield defects and reliability defects. IC＇ s failure probability can be estimated by this quantitative expression using this IC manufacturing yield, and the research and development period can be shortened.

关 键 词：成品率 失效率 缺陷 软故障 硬故障 

分 类 号：TN406[电子电信—微电子学与固体电子学]