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作 者:倪红卫[1] 但智钢[1] 许伯藩[1] 王世森[1] 熊平源[1] 李坤珍[1]
机构地区:[1]武汉科技大学材料与冶金学院,湖北武汉430081
出 处:《材料热处理学报》2005年第5期42-45,共4页Transactions of Materials and Heat Treatment
基 金:国家自然科学基金项目(50101009)
摘 要:以CuO+NH4Cl为渗剂对AISI304不锈钢表面进行化学渗铜处理,获得了具有优良抗菌性能的渗铜层。用扫描电镜及小掠射X射线衍射仪分析了渗层深度、微观组织及相组成。试验结果表明,当渗铜处理温度大于900℃后,渗铜层深度及渗层中富铜相Cu9.9Fe0.1及Cu3.8Ni的生成量快速增加。渗层中富铜相生成量越多,不锈钢的抗菌效果越佳,尤其是金黄色葡萄球菌。AISI304不锈钢经950℃保温4h渗铜处理后得到了较深的渗铜层,铜以富铜相形式均匀分布于渗层,具有优良的抗大肠杆菌和金黄色葡萄球菌的效果。The copperizing layer with excellent antibacterial property was obtained by chemical copperizing using CuO + NH4Cl as copperizing agent on the surface of AISI 304 stainless steel. The microstructure, depth and phase compositions of copperizing layer were revealed by scanning electron microscopy (SEM) and glancing angle X-ray diffraction (GXRD), respectively. Experimental results show that depth of the copperizing layer and amount of Cu-rich phases Cu9.9Fe0.1 and Cu3.8Ni increase obviously while copperizing temperature is over 900°C. The more the amount of Cu-rich phases, the better the antibacterial property, particularly against aureus (S. aureus). The deep copperizing layer is obtained by copperizing at 950°C for 4 h and copper element exists uniformly in the copperizing layer as Cu-rich phases. Results of antibacterial test show that the copperizing layer contained Cu-rich phases performs excellent antibacterial property against Escherichia coli (E. cioli) and Staphylococcus aureus (S. aureus).
分 类 号:TG156.8[金属学及工艺—热处理] TG142.71[金属学及工艺—金属学]
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