低熔封接玻璃的研究进展  

Progress in Research on Low-melting Sealing Glass

作　　者：郭宏伟[1] 刘新年[1] 赵彦钊[1] 高档妮[1] 

机构地区：[1]陕西科技大学材料科学与工程学院,咸阳712081

出　　处：《材料导报》2005年第F11期283-285,296,共4页Materials Reports

基　　金：陕西省教育厅专项科研计划项目（04JK206）

摘　　要：低熔封接玻璃是一种先进的焊接材料，由于其具有低的熔化温度和封接温度，优良的机械强度和化学稳定性，而在很多领域中得到广泛的应用，实现了玻璃、陶瓷、金属、半导体间的相互封接。综述了低熔封接玻璃的研究现状，展望了低熔封接玻璃向无铅化发展的趋势，指出了无铅低熔封接玻璃今后的研究方向。Low-melting sealing glass is an advanced sealing material, which is widely used in many fields due to its low melting temperature and sealing temperature, excellent mechanical strength and chemical stability. It has actualized the sealing between glass, ceramic, metal and semiconductor. This paper summarizes the current situation of low-melting sealing glass, predicts the development trend of lead-free low-melting sealing glass, and points out the further research direction of lead-free low-melting sealing glass,

关 键 词：低熔封接玻璃 焊接材料 填料 无铅化 磷酸盐 

分 类 号：TG42[金属学及工艺—焊接] TQ171.734[化学工程—玻璃工业]