环氧改性新型双酚A酚醛树脂的研制  

Development of Novel Bisphenol A-Phenolic Resin Modified with Epoxy Resin

作　　者：郑易安[1] 杨瑛[1] 李柯[1] 

机构地区：[1]兰州大学化学化工学院,甘肃兰州730000

出　　处：《材料保护》2005年第12期51-53,共3页Materials Protection

摘　　要：用苯酚-甲醛为原料的传统酚醛树脂中,游离酚的含量较高,使其在食品包装材料中的使用受到限制。以双酚A取代苯酚作主要原料,通过缩聚反应合成了新型双酚A酚醛树脂,通过正丁醇醚化、环氧树脂改性,热固化后形成兼具两种树脂优良性能的、耐酸、耐硫的复杂体型结构涂层。用红外光谱、热重-差热分析等技术对环氧改性的酚醛树脂的特征及热固化温度进行了研究,并测试了涂层浸泡液中游离酚及游离醛的含量。结果表明,环氧基全部参与了固化,涂层具有优良的耐热性能(386℃),且游离酚含量(0.047 2 mg/L)远低于相关国家标准要求(0.100 0 mg/L)。与传统的苯酚-甲醛树脂相比,该涂层更适宜于作为食品罐头内壁材料和防腐蚀材料使用。Traditional phenolic resin synthesized from phenol and methanal contains a great amount of free phenol,which limits its application as the material for food packaging.Thus a novel bisphenol A-based(BPA) phenolic resin was synthesized via the condensation polymerization of bisphenol A as the major raw material,aiming at replacing the conventional phenolic resin.The target resin of 3-dimensional net structure and excellent properties of both the phenolic resin and epoxy resin was thus prepared via the etherifying of n-butanol,modifying with epoxy,and thermosetting.The structural features and curing temperature of the modified phenolic resin were studied by means of infrared spectroscopy and thermogravimetry and differential thermal analysis.The content of free phenol and aldehyde in the immersion solution of the resin coating was measured.It was found that all the epoxy resin had participated in the curing process and the final target resin coating had excellent thermal stability(with the thermal decomposition temperature to be as high as 386 ℃) and resistance to acid and sulfur.At the same time,the newly developed phenolic resin coating had a free phenol content as low as 0.047 2 mg/L,which is much smaller than the limit(0.100 0 mg/L) specified in GB 4805-94 and GB/T 5009.69-2003.

关 键 词：环氧树脂 酚醛树脂 食品罐头 双酚A 内壁材料 

分 类 号：TQ630.7[化学工程—精细化工]