酸性介质中铜阳极溶出和阴极沉积过程的EQCM研究  

EQCM Studies of Anodic Dissolution and Cathodic deposition of Cu in Acidic Media

作　　者：陈国良[1] 卢江红[1] 董小玉[1] 李芳启[1] 方敏敏[1] 洪苏敏[1] 罗志英[1] 潘佳妹[1] 

机构地区：[1]漳州师范学院化学系,漳州363000

出　　处：《漳州师范学院学报（自然科学版）》2005年第4期50-53,共4页Journal of ZhangZhou Teachers College（Natural Science)

基　　金：福建省自然科学基金计划资助项目(E0310026);福建省教委科研基金资助项目;漳州市科技局资助项目

摘　　要：运用电化学循环伏安和石英晶体微天平(EQCM)方法研究了酸性介质中铜阳极溶出和阴极沉积过程.结果表明:铜阳极溶出和阴极沉积过程都只有一个电流峰,其M/n分别为32.0和34.2g/mol,且都是一个2-电子过程.在目前实验条件下,并未检测到Cu(I)中间产物,这与极谱研究酸性硫酸盐溶液中Cu2+只有一个极谱波相一致.本文从电极表面质量定量变化的角度提供了Cu阳极溶出和阴极沉积过程的新数据.The anodic dissolution and electrodeposition of Cu in acidic media have been investigated by using cyclic voltammetry and EQCM. The experimental results demonstrate that there is only one current peak at the anodic dissolution and cathodic position of Cu, the M/n value of which is 32.0 and 34.2 g / mol, respectively. No Cu^2＋ ions, adsorbed Cu（1） species or intermediate Cu^2＋ is evidenced by in situ EQCM measurements, which showes the anodic dissolution and cathodic position of Cu correspond to the 2-electron processes. The EQCM studies provide quantitative results of surface mass changes during electrodeposition and anodic dissolution of Cu, and have thrown new light in the elucidating electrodeposition and anodic dissolution of Cu.

关 键 词：CU EQCM 电沉积 阳极溶解 

分 类 号：O646.54[理学—物理化学] O433[理学—化学]