金属化微生物细胞镀层导电性研究  

Conductive Characters Research of Deposition Surfaces of Metallized Microorganism Cells

作　　者：陈博[1] 蔡军[1] 张德远[1] 

机构地区：[1]北京航空航天大学机械工程及自动化学院,北京100083

出　　处：《材料工程》2005年第12期26-29,共4页Journal of Materials Engineering

基　　金：国家自然科学基金资助项目(59975007);国家高技术研究发展计划(863计划)资助项目(2001AA421120)

摘　　要：从5种不导电的材料中筛选出化学镀效果最佳的材料作为基体,通过SEM,EDX对比该基体与细胞的表面镀层,最终通过测量所选基体表面镀层的电阻率间接研究7种用于微生物细胞金属化的镀层的导电性。结果表明:所选基体和细胞的表面镀层组成和成分基本一致;7种镀层中含Cu量达100%的镀层导电能力最强,含Ni 76.08%,Fe 15.53%,P 8.38%(原子分数)的NiFeP镀层导电能力最差,4种含Cu的镀层中,随含Cu量增加导电能力增强,但并非线性相关。Microorganism cells with different shapes such as sphere, rod-shape and helical shape, can be metallized to form hollow conductive metal-coated microparts by an electroless deposition technique,but the conductive characters were difficult to research directly. The optimal deposition substrate was selected from 5 nonconductive materials. The components of the electroless layers of selected samples and cells were compared by SEM and EDX analyses. Then the conductive characters of 7 kinds of deposition layers used for microorganism cells were researched indirectly by measuring the resistivities of the surfaces of selected substrates. The results showed that the components of the layers of selected substrates and cells were basically same. Among these 7 deposition layers, the conductive capability of Cu with 100% Cu was highest and the conductive capability of NiFeP with Ni 76.08 %, Fe 15.53 %,P 8.38% （atom fraction） was lowest. Among 4 layers which contain Cu component, the conductive capability increased with the proportion of Cu, but did not match linear relation.

关 键 词：生物加工 化学镀 电阻率 空心微颗粒 微生物 

分 类 号：TH16[机械工程—机械制造及自动化] TB34[一般工业技术—材料科学与工程]