三倍体毛白杨大片刨花板热压过程中导热性能的初探  

The Initial Study on Conductive Capability of Triploid Populus To mentosa Wafer Board During the Hot-pressing Process

作　　者：朱本城[1] 于志明[1] 李青青[1] 吴娟[1] 王力[2] 

机构地区：[1]北京林业大学材料学院,北京100083 [2]邹城市林业局

出　　处：《山东林业科技》2005年第6期1-3,共3页Journal of Shandong Forestry Science and Technology

基　　金：北京林业大学研究生自选课题培养基金项目资助

摘　　要：以大片刨花板含水率、厚度和密度等指标作为考察因素,通过试验,观察各因素对大片刨花板的比热及导热系数的影响,分析各个参数的变化规律。所得结论对于实际生产中的热压环节具有指导意义。This research is aimed to investigate the impaction on specific heat and conductive coefficient of the wafer board during the hot - pressing proeess. The related factors such as moisture content, target thickness and target density are observed and studied during the experiment. The results are deeply studied and analyzed, the impaction of each factor is revealed afterwards. The conclusion given by this study will have a great significant on the production practice.

关 键 词：大片刨花板 热压 导热系数 

分 类 号：S781.2[农业科学—木材科学与技术]