(Ni-W)-纳米Si_3N_4复合电镀工艺的研究  

A Research on the Plating Process of (Ni-W)-nano Si_3N_4 Composite Coatings

作　　者：吴玉程[1] 王莉萍[1] 李云[1] 舒霞[1] 郑玉春[1] 黄新民[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《电镀与环保》2005年第4期1-3,共3页Electroplating & Pollution Control

基　　金：安微省重点科研项目;合肥工业大学中青年创新群体基金(103037016)

摘　　要：研究了(Ni W)纳米Si3N4复合镀层的共沉积条件,考察了电流密度、温度和时间等操作条件对镀层沉积速率和显微硬度的影响。结果表明,随着电流密度提高,复合镀层的沉积速率和硬度不断增加,但当电流密度达到16A dm2,镀层的硬度下降;合适的镀液温度为75°C左右,沉积时间约60min。The co-deposition conditions of （Ni-W）-nano Si3N4 composite coatings are studied. The effects of current density, temperature, plating time, etc. on the deposition rate and micro-hardness of （Ni-W）-nano Si3N4 composite coatings are investigated. The results show that the deposition rate and micro-hardness of the composite coatings increase continuously with the increasing of current density, but the hardness will begin to fall down when current density reaches 16 A/dm^2 .The appropriate temperature is about 75℃ and deposition time about 60 min.

关 键 词：电沉积Ni—W 纳米SI3N4 复合镀层 工艺 性能 

分 类 号：TQ153[化学工程—电化学工业]