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作 者:姜俊青[1] 张延武[1] 刘金盾[1] 张永战[1]
出 处:《热固性树脂》2006年第1期29-31,共3页Thermosetting Resin
摘 要:采用水滑石降低环氧树脂/低分子质量聚酰胺固化体系的凝胶时间。考察了水滑石和丙氨酸交换后的水滑石及其加入量对体系凝胶时间的影响,发现水滑石的加入有利于凝胶时间的降低;当低分子质量聚酰胺∶环氧树脂的质量比值>0.7时,比未改性水滑石更有利于凝胶时间的降低;丙氨酸交换后水滑石的加入量越高,凝胶时间越短。The effect of hydrotalcite and organo - hydrotalcite exchanged by laetamic acid on gelation time of low molecular weight polyamide/epoxy resin system was studied. The results showed that addition of both hydrotalcite and (organo-) hydrotalcite exchanged by laetamic acid decrease the gelation time of low molecular weight polyamide/epoxy resin system, while organo- hydrotalcite was better than hydrotalcite for decreasing gelation time when the weight ratio of low molecular weight polyamide and epoxy was greater than 0.7 and gelation time of the system decreased as amounts of organo - hydrotalcite increase.
分 类 号:TQ323.5[化学工程—合成树脂塑料工业]
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