金刚石颗粒表面均匀电镀工艺研究  

Well-proportioned Electrodeposition on Diamond Grains

作　　者：陈超[1] 彭放[1] 张美光[1] 孙刚[1] 王江华[1] 

机构地区：[1]四川大学原子与分子物理所,四川成都610065

出　　处：《表面技术》2006年第1期40-43,共4页Surface Technology

摘　　要：介绍在金刚石颗粒表面均匀电镀金属的工艺。以镀镍为例研究金刚石表面化学镀、电镀的工艺。设计了一种新型、多用途金刚石表面电镀的装置。用此装置也可在其他导电或者不导电的小颗粒表面电镀或者复合镀金属。在金刚石表面化学镀上一层导电的金属以后，再以滚镀的方式将电镀层加厚，可获得厚度在10—200μm的均匀金属镀层。同时还介绍了电镀后金刚石表面镀膜厚度的计算方法和电镀过程中要注意的一些问题，并简介了补镀的工艺和方法。Well-proportioned metal electrodeposition on diamond grains was introducted. Taking Ni as a example,related method of electroless plating and electroplating was introduced. A new multipurpose device which is use for electroplating on diamond was designed. The equipment can be use to electroplate metal or composite electroplate metal on small metal or nonmetal grains. After chemical plating a conductive metal on diamond, the thickness of metal coating was increased by roller coating process. Besides, the calculation method of the thickness of the coating and something that we should care about and the craft and the method that repair to plate were introduced.

关 键 词：金刚石 电镀 化学镀 均匀电镀 

分 类 号：TQ153[化学工程—电化学工业]