TiNi形状记忆合金连接技术的研究进展  

Research Progress in Bonding Technology of TiNi Shape Memory Alloys

作　　者：李明高[1] 孙大谦[1] 邱小明[1] 孙德新[1] 殷世强[1] 

机构地区：[1]长春吉林大学材料科学与工程学院,130025

出　　处：《材料导报》2006年第2期121-125,共5页Materials Reports

基　　金：吉林省自然科学基金项目(20000518)

摘　　要：Ti Ni形状记忆合金具有很多优异性能,在航空航天、原子能、海洋开发、仪器仪表以及医疗器械等领域具有广阔的应用前景,而Ti Ni形状记忆合金的连接技术是其实用化的关键技术之一。综述了Ti Ni形状记忆合金连接技术的发展现状,重点评述了Ti Ni形状记忆合金激光焊、固相焊和钎焊的研究状况,指出了需要深入研究的问题。TiNi shape memory alloys have a wide application prospect in aviation and spaceflight, atomic energy, ocean development, instruments and medical appliances, etc. due to their multiple excellent properties, and the bonding technology of TiNi shape memory alloys is the key to their application in engineering. The research status of the bonding technology of TiNi shape memory alloys is introduced in this review, and the emphases are placed on laser welding, solid phase bonding and brazing..Some crucial issues to be investigated are suggested for the further development of TiNi shape memory alloy.

关 键 词：TINI形状记忆合金 连接技术 研究进展 

分 类 号：TG425[金属学及工艺—焊接]