浇注条件对Al-Cu合金组织的影响  

Effects of Different Pouring Conditions on the Micro-structure of Al-Cu Alloy

作　　者：高洪吉[1] 许斌[1] 牛玉超[1] 王伟民[2] 孙百来[1] 

机构地区：[1]山东建筑工程学院 [2]山东大学

出　　处：《特种铸造及有色合金》2006年第1期10-12,共3页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金资助项目(50301008)

摘　　要：利用扫描电镜和金相显微镜等手段,研究了浇注温度和冷却速度对Al-Cu合金组织的影响。结果发现,在Cu质量分数含量为5.65%的合金组织中出现了共晶组织,并随着浇注温度的升高,共晶组织体积分数明显增加。这是因为在Al-Cu合金熔体中存在着Al原子集团,随着熔体温度的升高,原子集团尺寸减小。而且发现随着冷却速度的减小,同一浇注温度下的同成分的合金组织中共晶组织体积分数减小,共晶层片间距的分布由集中变分散。The effects of pouring temperature and cooling rate on the microstructure of Al-Cu alloy was investigated by SEM and OP observation. The observation indicates that eutectic structure occurs in Al-Cu alloy with the 5. 65 % Cu content, increasing volume fraction of the eutectic structure with increase of the pouring temperature. The reduction of Al atom cluster in Al-Cu melt is reduce with the increase in temperature of the atom cluster in Al melt. Meanwhile, the volume fraction of the eutectic structure with the same composition is reduced and the distribution of the lamellar space becomes dispersive at the same pouring temperature with the decrease in the cooling rate.

关 键 词：Al—Cu合金 浇注条件 体积分数 层片间距 

分 类 号：TG27[金属学及工艺—铸造]