有机/无机复合透明耐磨薄膜的制备  

PREPARATION OF TRANSPARENT ABRASION-RESISTANT ORGANIC-INORGANIC HYBRID FILM

作　　者：陆静娟[1] 郭兴忠[1] 杨辉[1] 

机构地区：[1]浙江大学纳米科学与技术中心,浙江杭州310027

出　　处：《高分子材料科学与工程》2006年第1期211-214,共4页Polymer Materials Science & Engineering

基　　金：浙江省重点科技项目资助(011060)

摘　　要：以甲基丙烯酰氧基丙基三甲氧基硅烷(KH-570)水解聚合产物作为主要成膜物质,引入正硅酸乙酯(TEO S)水解产物硅溶胶作为无机增强物,调节两种混合溶液pH值,利用两者羟基之间的共缩聚反应在聚碳酸酯(PC)板表面制备有机/无机复合透明耐磨薄膜;采用TG/DTA、FT-IR、SEM及UV-V IS对成膜过程、薄膜性能与结构进行表征。结果表明,KH-570和TEO S水解聚合产物通过共缩聚反应在PC板表面形成带有有机基团的无机交联网络,基本骨架由S i-O-S i组成,经120℃热处理后,薄膜均匀致密,提高了PC板的耐磨性,并有一定的增透作用。The polymer produced by 3-（methacryloxypropyl-trimethoxysilane （KH-570） hydrolyzed and condensed in the solution with proper pH value was used as film forming materials, and silica sol produced by Tetraethylorthosilicate （TEOS） as the inorganic reinforcing materials. The pH value of the solution was adjusted, and the co-condensation reaction was taken place between the hydroxy groups forming transparent organic-inorganic hybrid films on polycarbonate （PC）. The film forming process, film property and structure were characterized by TG/DTA, FT-IR, SEM and UV-VIS. The hydrolysis and polymeric products yielded by KH-570 and TEOS respectively formed cross-linked inorganic structure endcapped by organic groups through co-condensation reaction. The base backbone was composed of Si-O-Si network structure. After heat-treated at 120℃, the film was uniform and densification, and can improve the surface abrasion resistance and clarity of PC.

关 键 词：水解 缩聚 有机无机复合 耐磨 薄膜 

分 类 号：TB383[一般工业技术—材料科学与工程]