V形槽硅微通道冷却器研制  

Fabrication of V-shaped silicon microchannel cooler

作　　者：李奇峰[1] 吕文强[1] 武德勇[1] 唐淳[1] 

机构地区：[1]中国工程物理研究院应用电子学研究所,四川绵阳621900

出　　处：《强激光与粒子束》2005年第B04期114-116,共3页High Power Laser and Particle Beams

基　　金：中国工程物理研究院基金资助课题

摘　　要：报道了V形槽硅微通道冷却器的结构和主要制作工艺,研制了冷却器样品。性能测试结果表明冷却器在供水压力为2×105Pa时,封装面热阻尼系数为0.051 ℃·cm2/W,能够用于封装峰值功率密度达到1 kW/cm2、工作占空比大于10%的激光二极管面阵。其冷却能力与数值模拟结果较吻合,尚存在流量较小的问题,原因可能在于导流槽内存在较大的水头损失,同时与导流槽的结构有关。A V-shaped Silicon microchannel cooler has an advantage of packaging compact laser diode arrays due to its high cooling power and specific structure. The structure and fabrication process of the V-shaped silicon microchannel cooler are reported. The cooler contains a silicon wafer and a glass manifold. The silicon wafer contains V-shaped grooves and microchannels of 30 μm wide which are etched by anisotropic etching after being photolithed. The whole cooler is formed by bonding silicon wafer to glass manifold. Some coolers were fabricated and tested. The results show that it has a thermal impedance of 0. 051℃·cm^2/ W for the single groove facet that match the results of numerical simulation, The cooler meets the requirement for packaging laser diode arrays with a peak power density up to 1000 W/cm^2 and duty cycle is more than 10 %. The average flow of the cooler is relatively small, it limits the cooler＇s cooling power.

关 键 词：V形槽 硅微通道冷却器 热阻 激光二极管面阵 

分 类 号：TN248[电子电信—物理电子学]