应用镍/铜胶体催化的环氧树脂化学镀镍  

Electroless nickel plating on epoxy resin by using Ni/Cu colloid catalyst

作　　者：何万强[1] 汪晖[1] 王文昌[1] 光崎尚利[2] 陈智栋[1] 

机构地区：[1]江苏工业学院化学工程系,江苏常州213016 [2]江苏工业学院(中日)太洋电子化工研究所,江苏常州213016

出　　处：《电镀与涂饰》2006年第3期17-19,共3页Electroplating & Finishing

基　　金：常州市国际合作项目(CZ2004001)

摘　　要：研究了利用镍/铜胶体活化的环氧树脂板的化学镀镍方法,给出了镀镍液的工艺配方:30g/LNiSO4·6H2O,10g/LCH3COONa,10g/LNaH2PO2·H2O,温度(80±2)℃,时间30min。探讨了用镍/铜胶体处理印制板时温度、时间和pH的影响,测定了化学镀镍层的剥离强度。实验结果表明,获得胶体溶液的pH为7.80,镍/铜胶体的粒径随酒石酸钠钾摩尔浓度的增加而减小,镀层的剥离强度为1.38kg/cm。The method of using nickel and copper colloids to activate the surface of epoxy resin was studied, and the formulation of nickel plating bath was given as follows： 30 g/L NiSO4·6H2O, 10 g/L CH3COONa, 10 g/L NaH2PO2 · H2O, temperature of （ 80 ± 2 ）℃, time of 30 min. The influences of temperature, time and pH on the process of PCB by using Ni/Cu colloid catalyst were discussed, and the peeling strength of nickel deposit was tested. The test results show that the pH value of colloid solution is 7.80, the particle diameter decreases with the increase of concentration of potassium sodium tartrate tetrahydrate, and the peeling strength of deposit is 1.38 kg/cm.

关 键 词：化学镀镍 镍/铜胶体 环氧树脂 剥离强度 

分 类 号：TQ153.12[化学工程—电化学工业] TQ323.5