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作 者:郭明星[1] 汪明朴[1] 李周[1] 雷若珊[1] 罗丽[1]
机构地区:[1]中南大学材料科学与工程学院,湖南长沙410083
出 处:《功能材料》2006年第3期428-430,共3页Journal of Functional Materials
基 金:国家高技术研究发展计划(863计划)资助项目(2002AA302505)
摘 要:通过力学性能、金相和TEM观察对低、中浓度Cu-Al2O3弥散强化铜合金的退火行为进行了研究。结果表明:低浓度弥散强化铜合金具有一定的抗高温软化性能,500℃退火后发生再结晶,900℃退火后已基本完全再结晶,屈强比约为56%。中浓度合金抗高温软化性能较好,900℃退火后,合金仍然以回复过程为主,金相尺度下不能看到再结晶晶粒,屈强比可迭70%。弥散强化铜合金优越的抗高温软化性能归功于铜基体内均匀弥散分布的纳米Al2O3粒子。Al2O3粒子尺寸在10~20nm内时,粒子间距〉200nm时,阻碍晶界迁移能力较差,粒子间距〈90nm时,可显著阻碍晶界的迁移,含金抗高温软化性能优越。Annealing behaviors of low and middle alumma cocentration dispersion strengthened copper alloys (DSCAs) were studied by mechanical properties measurment and OM,TEM observation. The results show,the resistance to softening at high temperature is not very strong for low alumina concentration DSCA,recrystation occurs as annealing at 500℃ ,and complete recrystation at 900℃ ,yield ratio reachs 56%. The resistance to softening at high temperature is much stronger for middle alumina concentration DSCA, only recovery occurs as annealing at 900℃ ,recrystal grains can not be observed through OM, and yield ratio is about 70%. The stronger resistance to softening at high temperature for DSCA is due to nano-alumina particles distributing in the copper matrix. As alumina particle size being 10-20nm,the resistance of particles to retard crystal boundary migration is poor when interval space is longer than 200nm and when internal space of particles is shorter than 90nm, the resitance is strong.
关 键 词:Cu-Al2O3弥散强化铜合金 退火 回复 再结晶
分 类 号:TG166.2[金属学及工艺—热处理] TG113[金属学及工艺—金属学]
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